Explore all 14 brand and family entries in the reference directory. Listed grade names are a navigation aid, not a stock list or an interchangeability approval. Where the reference names only a family, the listing says so.
RF laminates, digital laminates and bonding materials
AGC / Nelco / Taconic
The reference directory combines legacy Nelco and Taconic ranges. Confirm the current manufacturer designation and qualified bonding system for the exact grade.
Polyimide, low-flow and specialty laminate systems
Arlon
Polyimide and low-flow systems serve different construction needs. Legacy Thermount entries require explicit availability confirmation. Historic Arlon RF families also appear within the Rogers portfolio; do not assume supplier interchangeability.
Structural foam for antenna and radome assemblies
Evonik
Structural foam is not a copper-clad RF laminate. Specify its role as a spacer or core, adhesive compatibility and environmental requirements separately from the PCB stackup.
Flexible copper-clad polyimide construction
Hanwha
The reference page does not name a specific product grade. Request a current grade, copper type, film thickness and data sheet before making a controlled stackup specification.
Specific grades are not listed in the reference.
High-performance laminate and prepreg families
Isola
Use construction-specific properties for resin content and glass style. The listing includes standard, high-speed and RF families; their presence together does not imply equal RF performance.
Panasonic multilayer circuit material family
MEGTRON
MEGTRON is a Panasonic material family. R-5775 laminate and R-5670 prepreg are identified in Panasonic’s MEGTRON6 data sheet; a distributor name should not replace the manufacturer in the fabrication specification.
Embedded resistor materials
Ohmega Ticer
Specify sheet resistance, resistance tolerance, resistor dimensions, power dissipation and the approved laminate interface. These are resistive layers, not direct substitutes for dielectric cores.
FELIOS flexible materials and MEGTRON multilayer systems
Panasonic
FELIOS flex material and MEGTRON rigid multilayer families solve different construction problems. Specify the exact part number, copper and dielectric build rather than the brand alone.
Polyimide films, flexible laminates, coverlay and adhesives
Qnity / legacy DuPont Electronics
Distinguish the copper-clad core from coverlay and bonding layers. Confirm the complete flex construction, bend requirements and adhesive properties before analyzing the RF route.
RF and microwave laminates, bondply and flexible circuit families
Rogers
The reference mixes current families and legacy flexible materials. A series name is not a complete procurement specification. Identify the actual grade, thickness, foil and bonding construction; confirm lifecycle status before release.
Flexible base materials and coated films
Sheldahl
The reference gives a base-material family rather than individual grades. Request the actual film, metallization, adhesive and thickness specification for the intended construction.
Via-fill and functional electronic materials
TATSUTA
Confirm conductivity, cured properties and the intended fill process for the selected product. A material used to fill a via is not equivalent to electroplated copper and should not be treated as a dielectric laminate.
Flexible copper-clad laminates and coverlay
ThinFlex
The reference lists adhesiveless and adhesive flex construction types without grade numbers. Ask for the precise copper-clad and coverlay part numbers, bend conditions and finished thickness.
Specific grades are not listed in the reference.
FR-4, polyimide and specialty board materials
Ventec
FR-4 names a broad material class rather than one RF property set. Specify a grade and construction, then assess dielectric loss, thermal requirements and compatibility with other layers.
Choose a material by its job in the stackup
Start with frequency, route length, loss and phase requirements. Then identify which layers need RF performance and which support digital routing, mechanical flexibility or thermal management. A material brand alone cannot define a manufacturable board.
Dk, Df and construction
Check the test method, frequency, resin content, reinforcement and foil supplied with every quoted value. Design Dk and process Dk are used for different purposes. Do not combine values from unrelated test methods to create a false precision ranking.
Procurement and substitution
Record the manufacturer, grade, thickness, foil, bonding system and approved alternatives on the fabrication drawing. Require engineering review of substitutions affecting impedance, phase, loss or reliability. Legacy items in a directory need current availability confirmation.
Directory scope: the 14 entries and named products on the supplied material reference directory, reviewed 8 October 2026. This is not a claim to list every SKU currently sold by each manufacturer.
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