The final RF PCB design review should close the gap between what the engineer intends and what the fabricator can build. Organize the release around decisions and evidence, rather than a folder of files with unexplained names.
1. Freeze the electrical requirement
Record the operating bands, relevant impedance targets and the routes or structures that are most sensitive to change. Separate nominal goals from acceptance limits. Mark which structures require approval before a manufacturer adjusts geometry.
2. Approve the finished stackup
Check material grades, foil, finished copper and dielectric spacing. Total board thickness cannot substitute for the dielectric height of an RF line. If an alternative grade is allowed, identify who approves the electrical consequences.
3. Review return paths
Follow the signal and its reference through every connector and layer transition. Look for interruptions, changes in reference layer and ground structures that were added mechanically but never considered electrically.
4. Package manufacturing information
Export the agreed fabrication format, drill data, outline, drawing and impedance table from the released revision. Check that the file names and revision identifiers agree. State special processes explicitly rather than expecting the fabricator to infer them from copper features.
5. Define the evidence
Agree on continuity testing, impedance coupons and relevant inspection records. Then define the separate RF measurements needed on the assembled prototype. Retain the calibration and fixture details so another engineer can reproduce the comparison.
Release checklist
- Requirements and critical structures identified.
- Finished stackup approved.
- Manufacturing questions resolved in writing.
- Exported files checked against the release revision.
- Prototype measurement plan ready before boards arrive.
Discuss this requirement for your board
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